KUALA LUMPUR – Dagang NeXchange Bhd (DNeX) subsidiary SilTerra Malaysia Sdn Bhd has entered into a wafer supply and purchase agreement with ChipOne Technology (Beijing) Co Ltd worth US$400 million (RM1.69 billion).
In a statement today, DNeX said under the multi-year agreement, SilTerra will supply wafers used in the production of semiconductor devices to ChipOne Technology, China’s leading driver integrated circuit (IC), touch controller and fingerprint sensor fabless IC design house.
Group managing director and SilTerra executive chairman Tan Sri Syed Zainal Abidin Syed Mohamed Tahir said the agreement will see the DNeX unit having a guaranteed wafer base load for the next several years, and ensure a high factory utilisation rate for the company going forward.
“We are pleased for SilTerra to enter into this agreement with one of the leading semiconductor chip design companies in China. This shows the commitment of the new shareholders of SilTerra to transforming the company through driving sustainable business.
“IC designers are striving to deliver energy-efficient products, and this is aligned with strategies towards energy conservation and sustainability. As such, they look to adopt smart-power design techniques, as well as advanced power technologies, to meet this objective.”
He added that SilTerra will leverage its proven process technology, foundry design kits and intellectual property to deliver optimum energy-efficient products.
DNeX recently completed the acquisition of a 60% equity interest in SilTerra from Khazanah Nasional Bhd, making it the majority shareholder. – Bernama, August 4, 2021
