THE ASEAN Semiconductor Summit (ASEMIS) 2025, held in Kuala Lumpur on 24 July, has been hailed as a major step forward for regional collaboration in the semiconductor industry, Deputy Investment, Trade and Industry (MITI) Minister Liew Chin Tong told the Dewan Rakyat today.
The Deputy Speaker was informed that the summit, jointly organised by MITI and the Malaysia Semiconductor Industry Association (MSIA), achieved a key milestone with the signing of a Memorandum of Understanding (MoU) among five ASEAN semiconductor associations from Malaysia, Singapore, Thailand, Vietnam and Indonesia.
The MoU marks a collective commitment to strengthen cooperation through information sharing, the development of common standards and joint initiatives to address supply chain challenges across the region.
“This effort aligns with one of Malaysia’s Priority Economic Deliverables (PED) under its ASEAN Chairmanship this year — the establishment of the ASEAN Framework for Integrated Semiconductor Supply Chain (AFISS),” Liew stated.
AFISS focuses on supply chain integration, technological and infrastructure development, and talent cultivation. “The central idea is to view ASEAN Member States as partners, not competitors,” Liew said.
As part of ASEAN’s ongoing cooperation, the Philippines, which will assume the ASEAN Chairmanship in 2026, has agreed to host the next edition of ASEMIS, ensuring continuity in regional collaboration.
At the official ASEAN level, the development and implementation of AFISS will remain a shared priority among member states after Malaysia’s chairmanship concludes, reflecting the bloc’s long-term vision of positioning ASEAN as a unified force in the global semiconductor value chain. - October 30, 2025
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